✦ FOUR POINTS PLATINUM ✦ SINCE 2009 ✦ SERVING NATIONAL & LOCAL BRANDS ✦ DELL ✦ IBM ✦ 3M ✦ BLANKET ORDERS ✦ LOGISTICS ✦ COMPLETE PROJECT MANAGEMENT ✦ 512-382-0430 (MAIN) ✦ SALES: EXT. 101 ✦ GENERAL PRODUCTION STATUS: EXT. 102 ✦ MECHANICAL MANUFACTURING: EXT. 103 ✦ ELECTRONICS MANUFACTURING: EXT. 103 ✦ CNC MACHINING ✦ FABRICATION ✦ ASSEMBLY / BOX BUILDS ✦ ADVANCED MANUFACTURING TECHNOLOGY ✦
✦ FOUR POINTS PLATINUM ✦ SINCE 2009 ✦ SERVING NATIONAL & LOCAL BRANDS ✦ DELL ✦ IBM ✦ 3M ✦ BLANKET ORDERS ✦ LOGISTICS ✦ COMPLETE PROJECT MANAGEMENT ✦ 512-383-0430 (MAIN) ✦ SALES: EXT. 101 ✦ GENERAL PRODUCTION STATUS: EXT. 102 ✦ MECHANICAL MANUFACTURING: EXT. 103 ✦ ELECTRICAL MANUFACTURING: EXT. 103 ✦ CNC MACHININGCNC MACHINING ✦ FABRICATION ✦ ASSEMBLY / BOX BUILDS ✦ ADVANCED MANUFACTURING TECHNOLOGY ✦
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Precision-Driven Electronics Manufacturing

Advanced PCB assembly & surface mount technology solutions for complex, high-reliability electronic assemblies.

PCB ASSEMBLY
SMT PLACEMENT
THROUGH-HOLE ASSEMBLY
ADVANCED MT
Explore Capabilities

Overview

Four Points Platinum Electronics Manufacturing provides high-tolerance PCB assembly, surface mount technology (SMT), and rugged through-hole integration engineered for complex, mission-critical electronic systems. Our specialized manufacturing facility is purpose-built for high-mix, low-to-mid-volume production, where signal integrity, flawless component solder joints, and rigid process controls matter more than mass-commodity speed.

From dense multi-layer boards to custom ruggedized control systems, our electronic production lines are executed with uncompromising attention to detail—ensuring strict component alignment, zero-defect solder wetting, and total trace compliance across your entire production run.

Electronics Excellence Philosophy

Our approach to precision circuit board population and system integration prioritizes:

  • Precision over shortcuts: Absolute adherence to strict IPC assembly and class-defined soldering standards on every single production lot.
  • Repeatability over raw speed: Highly calibrated, stable placement and thermal reflow processes that eliminate component drifting or thermal stress.
  • Verification over assumptions: Rigorous in-line automated optical inspection (AOI) and comprehensive non-destructive X-ray testing.
  • Seamless single-source execution: Fully integrated component sourcing, board population, and final functional testing under a single quality system.
Real-world performance is driven by circuit layout optimization, component placement accuracy, and strict thermal profile management – not by the theoretical peak placement speeds listed in an equipment brochure.
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PRINTED CIRCUIT BOARD ASSEMBLY

FULL-TURNKEY COMPONENT POPULATION & RIGID QUALITY CONTROLS

Four Points Platinum delivers comprehensive printed circuit board assembly solutions, managing your bare board fabrication, component sourcing, and high-reliability population under a single unified quality system.

These platforms are optimized to support high-mix electronic assemblies, multi-layer circuit routing, and complex component bills of materials, without sacrificing trace integrity or structural performance.

  • PCB ASSEMBLY CAPABILITIES
  • Turnkey Procurement: End-to-end component sourcing and material management utilizing verified, trace-documented distribution networks.
  • Multi-Layer Substrates:Precision handling of high-density interconnect (HDI) layers, rigid-flex configurations, and specialized FR4 materials.
  • Rigid Prototyping: Rapid-turnaround assembly services optimized to validate engineering designs before transitioning to full production scaling.
  • Lead-Free & Leaded Process: Versatile manufacturing lines supporting both RoHS-compliant finishes and traditional tin-lead military configurations.

SURFACE MOUNT TECHNOLOGY (SMT)

HIGH-SPEED ROBOTIC PLACEMENT & REFLOW INTEGRITY

Our dedicated SMT division utilizes automated, ultra-precise pick-and-place lines alongside multi-zone thermal profiles to guarantee flawless solder joints across complex component geometries.

  • AUTOMATED SMT CAPABILITIES:
  • High-Velocity Pick-and-Place: Precision placement of micro-passives, fine-pitch ball grid arrays (BGAs), and complex quad flat packs.
  • Multi-Zone Reflow Profiles: Controlled, multi-stage thermal baking setups engineered to eliminate component stress and ensure perfect wetting.
  • Solder Paste Inspection (SPI): Automated in-line volumetric scanning to verify paste height, volume, and alignment before component placement.
  • Dual-Sided SMT Placement: High-repeatability robotic staging for complex electronic architectures requiring high-density dual-sided populations.

These platforms are optimized to support fine-pitch micro-component placement, uniform solder wetting, and automated paste validation, without sacrificing throughput or structural joint alignment.

THROUGH-HOLE ASSEMBLY & WAVE SOLDERING

HIGH-STRESS TRANSITION & RUGGED INTEGRATION STANDARDS

For power electronics, heavy connectors, and high-vibration applications, our specialized through-hole assembly team delivers robust, structurally reinforced mechanical connections that surface mount components cannot match.

These platforms are optimized to support high-stress structural soldering, automated wave bath processing, and secondary component masking, without sacrificing thermal limits or mechanical alignment.

  • SYSTEM INTEGRATION & ASSEMBLY
  • Turnkey Electro-Mechanical Assembly: Full integration of machined parts, sheet metal chassis, and internal electronic hardware.
  • Hardware & Component Fastening: High-repeatability installation of structural fasteners, PEM inserts, and mechanical linkages.
  • Interconnect & Cable Routing: Precision routing and tie-down of internal wiring, harnesses, and power connections to eliminate stress points.
  • Final Fit & Finish Verification: Comprehensive physical checks to guarantee perfect sub-system alignment and enclosure sealing before final deployment.

ADVANCED METROLOGY & QUALITY ASSURANCE

AUTOMATED OPTICAL TRACKING & MULTI-LAYER VERIFICATION

We protect the performance and field reliability of your electronic assemblies through continuous, automated optical tracking, non-destructive X-ray verification, and physical functional validation.

  • METROLOGY & QUALITY PILLARS:
  • Automated Optical Inspection (AOI): High-resolution camera tracking cross-referencing component presence, value orientation, and solder fillets.
  • 3D X-Ray Inspection (AXI): Non-destructive radiographic scanning to verify hidden solder connections beneath dense BGA arrays.
  • In-Circuit Testing (ICT): Comprehensive electrical node testing to isolate and verify component functionality and parametric performance.
  • Functional Circuit Validation: Full-system operational testing replicating environmental stresses to ensure performance under actual load.

These platforms are optimized to support hidden solder bridge identification, component orientation scanning, and real-time defect isolation, without sacrificing assembly velocity or throughput limit

Ready to Secure Your Electronics Production Schedule?

If your PCBA, SMT placement, or rugged through-hole requirements demand tight tolerances, zero-defect process discipline, and rigorous inspection standards, start with a controlled RFQ and a technical discussion.

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