✦ FOUR POINTS PLATINUM ✦ SINCE 2009 ✦ SERVING NATIONAL & LOCAL BRANDS ✦ DELL ✦ IBM ✦ 3M ✦ BLANKET ORDERS ✦ LOGISTICS ✦ COMPLETE PROJECT MANAGEMENT ✦ 512-382-0430 (MAIN) ✦ SALES: EXT. 101 ✦ GENERAL PRODUCTION STATUS: EXT. 102 ✦ MECHANICAL MANUFACTURING: EXT. 103 ✦ ELECTRONICS MANUFACTURING: EXT. 103 ✦ CNC MACHINING ✦ FABRICATION ✦ ASSEMBLY / BOX BUILDS ✦ ADVANCED MANUFACTURING TECHNOLOGY ✦
✦ FOUR POINTS PLATINUM ✦ SINCE 2009 ✦ SERVING NATIONAL & LOCAL BRANDS ✦ DELL ✦ IBM ✦ 3M ✦ BLANKET ORDERS ✦ LOGISTICS ✦ COMPLETE PROJECT MANAGEMENT ✦ 512-383-0430 (MAIN) ✦ SALES: EXT. 101 ✦ GENERAL PRODUCTION STATUS: EXT. 102 ✦ MECHANICAL MANUFACTURING: EXT. 103 ✦ ELECTRICAL MANUFACTURING: EXT. 103 ✦ CNC MACHININGCNC MACHINING ✦ FABRICATION ✦ ASSEMBLY / BOX BUILDS ✦ ADVANCED MANUFACTURING TECHNOLOGY ✦
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PCB / SMT Capabilities:

Precision Electronic Manufacturing

  • Turn-Key Builds - Hybrid Assemblies - Early Development
  • Protoyping - On-Site Revisions - Lead & Lead Free Capability
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Explore Capabilities

Overview

Four Points Platinum Machining and Manufacturing provides in-house PCB and Surface Mount Technology (SMT) assembly designed for precision, flexibility, and control. Out electronic manufacturing capability is purpose-built for high-mix, low-to-mid-volume production, where process discipline and integration matter more than theoretical speed.

PCB and SMT operations are executed under the same operating system that governs our machining and mechanical assembly – ensuring alignment, accountability, and repeatability across the entire product build.

Electronics Manufacturing Philosophy

Our approach to PCB and SMT assembly prioritizes:

  • Controlled processes over advertised rates
  • Repeatability over peak output
  • Quality verification over assumptions
  • Integration over vendor handoffs

Actual production performance is determined by board complexity, component mix, inspection requirements, and customer-defined quality standards, not by generalized machine specifications.

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SMT Assembly & Component Placement

PRECISION PLACEMENT SYSTEMS

Four Points Platinum utilizes modular SMT placement platforms configured for flexibility, accuracy, and repeated setup.

These systems are optimized to support engineering builds, pilot runs, and repeatable production, without sacrificing control or documentation.

  • CAPABILITIES INCLUDE:
  • Fine-pitch and miniature component handling
  • Support of a wide range of passive and active components, including advanced packages
  • Vision-based alignments for precise placement
  • Rapid-changeover for high-mix production environments
  • Software-driven job setup and New Product Introduction (NPI) support

Solder Paste Printing

HIGH-PRECISION SCREEN PRINTING

Solder paste deposition is a critical driver of SMT quality. Our printing process is engineered for consistency, alignment accuracy, and defect prevention.

  • PRINTING CAPABILITIES:
  • Fine-pitch and high-density PCB support
  • Automated fiducial recognition and alignment
  • Closed-loop of print parameters
  • Programmable stencil handling and snap-off control
  • Automated stencil cleaning cycles

This approach minimizes print-related defects and supports repeatable assembly outcomes, especially in high-mix environments.

REFLOW SOLDERING & THERMAL CONTROL

CONTROLLED REFLOW PROCESSING

Reflow soldering is executed using milti-zone thermal systems designed for uniform heating, controlled colling, and stable lead-free profiles.

  • REFLOW CAPABILITIES
  • Multi-zone thermal profiling for complex assemblies
  • Support for standard and wide-format PCBs
  • Controlled cooling to protect component integrity
  • Nitrogen-ready processing when required
  • Automated profile generation and data capture
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Thermal processes are validated and documented to ensure repeatable solder joint integrity accoss production runs.

X-RAY INSPECTION & QUALITY VERIFICATION

NON-DESTRUCTIVE INSPECTION (NDI)

For assemblies where visual inspection is insufficient, Four Points Platinum employs macrofocus X-ray inspection to verify internal solder joint quality without damaging components.

Real-Time Defect Detection:
Our X-ray protocols provide immediate feedback for process optimization, identifying micro-voiding, bridging, and component misalignment at the source to ensure 100% structural integrity.

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  • INSPECTION CAPABILITIES:
  • BGA, QFN, CSP, flip-chip, and hidden joint inspection
  • Detection of voids, opens, bridging, cracks, and misalignment
  • Multi-angle analysis for comprehensive evaluation
  • Real-time imaging with digital enhancement
  • QUALITY & DOCUMENTATION
  • Repeatable inspection routines
  • Defect classification and reporting
  • Data logging to support traceability
  • Verification for process development and rework validation

INTEGRATED ELECTRONIC MANUFACTURING

TOTAL SYSTEM ASSEMBLY & TEST

PCB and SMT assembly at Four Points Platinum is fully integrated with our mechanical machining and assembly operations.

This approach reduces delays, misalignment, and risk common in multi-vendor supply chains.

  • INTEGRATION MEANS:
  • Electronic assemblies are designed with mechanical fit and system requirements in mind
  • PCB builds are scheduled in coordination with machined housings and assemblies
  • Change management is handled across mechanical and electronic elements simultaneously
  • Accountability remains with a single manufacturing partner

PRODUCTION FIT & SCALABILITY

OUR PCB/SMT CAPABILITY IS BEST SUITED FOR CUSTOMERS REQUIRING:

A production floor purpose-built to navigate the complexities of modern electronics manufacturing with extreme precision.

  • CUSTOMERS REQUIRING:
  • High-mix, precision electronics assemblies
  • Low Volume
  • Development Prototyping
  • New Product Introduction
  • Engineering-driven builds
  • Prototype-to-production transitions
  • Controlled scaling without loss of process discipline
  • Vendor consolidation for selected electromechanical products

Production planning is capacity-aware and intentional, ensuring quality and delivery expectations are aligned before work begins.

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EQUIPMENT CAPABILITY OVERVIEW

(RATE-NEUTRAL)

Equipment is configured for precision, flexibility, and controlled production, with actual throughput determined by product requirements and custom-defined quality standards.

FUNCTION

CAPABILITY FOCUS

KEY STRENGTH

Solder Paste Printing

Precision deposition

Repeatable paste control and rapid changeover

Reflow Soldering

Thermal consistency

Uniform profiles with documented control

X-Ray Inspection

Quality verification

Non-destructive internal joint inspection

Ready to Secure Your Production Schedule?

If your PCB or SMT requirements demand precision, process discipline, and integration, start with a controlled RFQ and a technical discussion.

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